Semiconductor Enhancement Products

m IC Packages - ISI designs and manufactures a broad line of high lead count IC packages utilizing printed circuit board interconnects, unique molding capabilities and thermal management solutions. m Few Chip Modules - ISI can help you improve performance and lower cost through design solutions by isolating high performance components on high count multi-layer PCB's that then connect to lower layer count motherboards. m Footprint Conversion Products - ISI has produced more than 1,000 adapters that convert one semiconductor form factor to another. Examples: BGA to PGA, BGA to QFP, BGA to BGA, QFP to BGA, SMT to DIP, SMT to SMT, PGA to PGA Page 6 Bare Die to PCB or Flex ISI will design a solution and assemble bare die (wire bond or flip chip) to a printed circuit board or flexible circuit. m Flex Circuit Assemblies - ISI offers design through production flexible circuit solutions. Flexible circuit technology is used in discrete packages for improved circuit density. Through the use of unique assembly processes, ISI can reduce the size and cost of complex circuitry.